SteelCon®
For cutting inserts
The HiPIMS coating material SteelCon® is the latest silicon doted HiPIMS coating material from CemeCon. It enables economical machining of hardened as well as stainless steels.
SteelCon® achieves first-class surface quality under the extreme conditions of hard machining. High hardness is combined with excellent adhesion. The homogeneous wear behavior of SteelCon® ensures high process stability. In addition to the dense layer structure, the particularly high silicon doting also ensures good thermal stability.
SteelCon® achieves first-class surface quality under the extreme conditions of hard machining. High hardness is combined with excellent adhesion. The homogeneous wear behavior of SteelCon® ensures high process stability. In addition to the dense layer structure, the particularly high silicon doting also ensures good thermal stability.
Item no.: 36444-1
Process know-how made by CemeCon
You not only receive the recipe for our coating, but also the complete know-how of pre- and post-treatment for the peripherals we supply. Another component of our know-how package is the hardware specially adapted to the coating process, our targets, foils and accessories as well as the process updates for our recipes!
Stay on the ball!
Here you can find our coating material flyer!
You not only receive the recipe for our coating, but also the complete know-how of pre- and post-treatment for the peripherals we supply. Another component of our know-how package is the hardware specially adapted to the coating process, our targets, foils and accessories as well as the process updates for our recipes!
Stay on the ball!
Here you can find our coating material flyer!
Technical data
Coating unit
CC800®HiPIMS
Expansion Stage
AS3
AS3C
AS3C2
Coating Technology
PVD HIPIMS
Layer composition
TiAlSiN
Tool type
Indexable inserts
Tool material
Carbide
Material
Hardened steel
Stainless steel
machining application
Drill
Mill
Turn
Stitching
Thread
Application temperature
1.100°C
Expansion Stage
Color
Red gold
Available layer thickness
3 µm
Targetkonfiguration
2*item 33788/2*item 35082/2*item 33790